Huawei's new AI chip set for early release! Performance doubled
People's Daily Japanese Edition 18 September 2026 13:27
Huawei's annual event 'Huawei Connect 2026' was held on 17 September. Rotating Chairman Wang Tao gave a speech at the conference, explaining the core of Huawei's artificial intelligence (AI) strategy and revealing future plans in computing power and AI chips.
Wang Tao officially launched the 'Ascend 960 Super Cluster', saying: 'The Ascend 960 Super Cluster is the world's first super cluster to use NPO (Near Photonic Interconnect) technology, capable of supporting large-scale training and inference for AI models with a scale of 100 trillion parameters.'
Talking about AI chips, Wang Tao pointed out: 'The Ascend 960 chip is ahead of schedule and now on standby, with performance doubled. The Ascend 960DT is three quarters ahead of the original plan, expected to be released in Q1 2027 (January-March); the Ascend 960PR is one quarter ahead, expected in Q3 2027 (July-September). Thereafter, an annual upgrade is expected, with Ascend 970 planned for 2028 and Ascend 980 planned for 2029.' (Editor KS)
'People's Daily Japanese Edition' 18 September 2026

